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Spansion FL-S

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• Spansion Begins Initial Sampling of Flash Memory Based on Second-Generation MirrorBit^TM Technology
  Upgraded density-doubling technology will extend Spansion's price-performance lead April 20, 2004 - Spansion announced that it is supplying an initial group of customers with hundreds of engineering samples based on second-generation, 110-nanometer MirrorBit technology . These standalone and stacked multi-chip (MCP) samples enable AMD and Fujitsu customers to integrate this technology into designs targeted for production in the third quarter. Optimized for 1.8-volt wireless designs, ...
• Spansion and TSMC Team to Manufacture Innovative Flash Memory Technology
  Leading Flash and Foundry Suppliers Partner to Supplement Manufacturing for Spansion's 110 Nanometer MirrorBit Technology Spansion LLC , the Flash memory venture of AMD and Fujitsu Limited , and Taiwan Semiconductor Manufacturing Company (TSMC) announced a manufacturing agreement that will augment Spansion's internal production of its 110 nanometer (nm) MirrorBit technology. Pursuant to the agreement, TSMC will supply foundry manufacturing capabilities for Spansion's family of GL, PL and WS ...
• Spansion Introduces Innovative Package-on-Package Solution To Reduce Wireless Device Size
  Spansion's Solution Reduces Form Factors as Devices Adopt New Features Spansion LLC announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, feature-rich wireless phones, PDAs, digital cameras and MP3 players. Spansion's new PoP solution vertically combines discrete logic and memory packages for board space savings, lower pin-count, simplified system integration and enhanced performance. As a result, handset manufacturers can ...